Simulated microfluidic stack: Si 14 | Ag 47 | Ti 22 | S 16 | Xe 54 | N 7 seal | C 6 | O 8
This simulation models a minimal 3-layer microfluidic kernel stack. From bottom to top:
Si 14: Silicon substrate base layer. Provides mechanical support and thermal uniformity.Ag 47: Silver core electrode. High conductivity for signal/power routing.Ti 22: Titanium traces. Diffusion barrier and adhesion layer between Ag and active region.S 16: Sulfur trap layer. Passivates surface states and getters ionic contaminants.Xe 54: Xenon gas gap. Compressible buffer for pressure equalization, low thermal conductivity.N 7 SU-8: Nitrogen-rich epoxy seal. 2s2 2p3 valence enables 3 crosslink bonds per N. Shown as 3 laser etch paths.C 6 + O 8: External environment with atomic oxygen O1 and H2O vapor.SU-8 is a negative-epoxy photoresist. Its crosslink density comes from nitrogen sites. Each N atom has electronic config [He] 2s2 2p3: 5 valence electrons, 3 unpaired in 2p orbitals. This gives 3 covalent bonding sites per N, shown here as "3 lasers" representing UV crosslink exposure paths during patterning. Higher N density = higher crosslink = higher modulus and chemical resistance.
The SU-8 N seal must hold 1 GPa internal water pressure. Simulation shows leak rate as function of:
Seal ON: N crosslinks active. Permeability < 1e-6. Holds 1 GPa with < 0.1 pL/s leak.Seal OFF: N bonds broken. Permeability rises 1000x. Leak rate scales with ΔP.O1 attack: Atomic oxygen abstracts H from SU-8, breaks C-N bonds. Each % O1 reduces seal effectiveness 2%.H2O: Hydrostatic pressure differential drives permeation if seal fails.IN pulse: Injects charge into Ag core, creates electrostatic displacement D. 10kHz clock modulates Ti trace bias. OUT current measures displacement current. D is gap change in Xe region. Leak rate computed from Darcy's law through SU-8.
Leak = k * A * ΔP / μL where k=permeability. With Seal ON: k=1e-18 m². Seal OFF: k=1e-15 m². O1 degrades k exponentially. All vanilla JS, no dependencies. Canvas renders at 60fps.